COB costs are decreasing rapidly

COB costs are decreasing rapidly, and it is accelerating the replacement of traditional SMD LED displays! As people's requirements for display effects become more and more high-definition, "5G+8K ultra-high definition" continues to develop. In the LED display industry, small-pitch LEDs have also begun to continuously break through the upper limit of ultra-high-definition display. Small-pitch LEDs and even micro-pitch LED displays have become an inevitable trend.

The development of the industry.

COB was born in 2012. From the choice of international manufacturers to the participation of medium-sized manufacturers, the number of players has jumped from single digits to tens, which indirectly illustrates the market feasibility of COB.

The packaging technologies of LED displays mainly include DIP packaging technology, SMD packaging technology, IMD packaging technology, and COB technology. Among them, SMD packaging technology is mature and stable, with strong cost advantages, and is therefore the mainstream packaging technology in the current LED display industry.

Since SMD has good clarity and cost, and the technology is mature, why is COB replacing SMD?

The core driving force is two: the market's pursuit of better display effects is always there. COB has more obvious advantages in technology. Even if the cost is much higher than SMD now, it is difficult to stop COB from replacing SMD, just as SMD replaced DIP in the past.

COB technology is called "million-level technology" because it can control pixel failure points within 1-9 in 1 million display pixels, while SMD technology has a pixel failure rate of only "ten thousand level", which does not meet the requirements of small pitch and ultra-high-definition display. Flip-chip COB technology greatly increases current density, improves stability and light efficiency of lamp beads, and the flip-chip structure simplifies the production process to achieve better display effects. It can achieve chip-level spacing and has reached the level of Micro LED.

As a "million-level" packaging technology, COB technology not only helps usher in the era of 0.Xmm high-definition displays but also brings innovation to the industry chain with a fresh perspective. This is evident in the distinct layout of the COB technology production process and production line equipment compared to SMD packaging technology. COB technology streamlines and simplifies the production process for packaging companies and display manufacturers, making it easier to organize and control. Additionally, COB technology offers significant advantages in heat dissipation, efficient space utilization, moiré reduction, and post-maintenance.

Starting from 2023, with the continuous advancement of COB display technology, COB production technology is also constantly improving, production efficiency is improved, and production costs are reduced, resulting in a drop in COB prices. COB displays are being increasingly used in indoor high-end display scenarios. At present, the process of COB displays replacing LED displays is just like the process of SMD surface-mount LEDs replacing direct-plug displays. It is an iteration of technology and is unstoppable.